5+ day, 2+ hour ago   (357+ words) AI Semiconductors Enter the System Scaling Era: Advanced Packaging, CPO, HBM, FOPLP, and Testing Emerge as the Next Key Battlegrounds Based on SemiVision’s observations from the technical forums, industry discussions, and exhibition floor at SEMICON Taiwan 2026, the most important industry…...

5+ day, 14+ hour ago   (433+ words) If NVIDIA’s message at Hot Chips 2026 had to be summarized in one sentence, it would be this: the next phase of competition is no longer about who has the fastest GPU. It is about who can combine compute, memory, networking,…...

6+ day, 13+ hour ago   (25+ words) semivision Continue reading this post for free, courtesy of SEMIVISION....

1+ week, 6+ hour ago   (175+ words) semivision When AI Chips Depend on a Bottle of Gas: How WF₆ Is Emerging as a New Bottleneck Oroginal Article By SemiVision Research [Reading time: 10 mins] The semiconductor supply constraints created by the AI boom are moving progressively upstream. Over the…...

1+ week, 13+ hour ago   (326+ words) The AI era, however, is beginning to rewrite this division of responsibilities. The central idea Samsung introduced at Hot Chips 2026 is to apply advanced logic processes to the HBM Base Die, transforming the B-die from what has historically been a…...

1+ week, 6+ day ago   (1406+ words) The next phase of the semiconductor race will be less about copying fabs than about connecting talent, tools and specialised technologies Thank you, TechSoda Research for the invitation. It was a very well-organized and insightful event! For most countries, industrial…...

2+ week, 1+ day ago   (111+ words) semivision SemiVision Weekly Intelligence | 2026 August Week 4 Original Article By SemiVision Research [Reading time: 7 mins] NVIDIA’s results confirm that the AI buildout is still accelerating, but the center of risk is moving downstream. Rubin rack production is pulling simultaneously on HBM,…...

2+ week, 4+ day ago   (183+ words) Intel’s Diamond Rapids presentation at Hot Chips 2026 looks, at first glance, like another server-CPU specification update. Up to 256 performance cores 1.28GB of last-level cache. Up to 1.6TB/s of memory bandwidth. 128 lanes of high-speed I/O. Intel 18A-P compute silicon. Those numbers matter,…...

2+ week, 5+ day ago   (57+ words) AI chips are consuming more substrate material just as manufacturing yields are becoming harder to improve Note: This is only a rumor at this stage and has not been officially announced or confirmed. For substrate makers struggling to secure enough…...

2+ week, 6+ day ago   (211+ words) A new direction is emerging in AI infrastructure in 2026: NAND flash is no longer being treated solely as storage inside SSDs. Instead, it is beginning to evolve toward a near-compute, high-bandwidth, high-capacity memory tier. One of the most representative technologies…...