A critical component of physical AI infrastructure is the printed circuit board, but it has been difficult in the US for designers of electric vehicles, humanoids and wearables to get quick turnaround of PCB prototypes for use in their new…
AMSI Lab is partnering with six faculty members who will initiate projects spanning biomechanics, materials science, robotics, design, computer vision, and athlete preferences and behavior, with potential applications to future running footwear, apparel, and performance technologies: Bio-Inspired Designs for Specialized…
Research from the lab is expected to begin informing new Asics running and performance products by 2028. Asics has opened a new academic research and development laboratory on the University of Michigan‘s Ann Arbor campus. Called the Asics Michigan Sport…
TSMC reportedly still won't use new High-NA EUV lithography machines for its next-gen A14 (1.4nm) process node, will rely on old semiconductor equipment. TSMC will not use High-NA EUV lithography for its next-gen A14 (1.4nm) process in 2028, opting for conventional 0.33-NA EUV machines to…
Technology and production preparations in the mask industry for ASML's next-generation High-NA EUV lithography tools are accelerating as DRAM makers and foundries firm up adoption timelines. Industry schedules point to mass-production introductions starting from 2028. While Japanese suppliers have effectively dominated…
At the SPIE Photomask Technology + Extreme Ultraviolet Lithography conference, Intel Foundry and ASML highlighted continued progress in bringing high numerical aperture (High NA) extreme ultraviolet... Overlay, throughput and availability are meeting Intel Foundry's expectations Advertisment Add DQIndia Info As A…
Fig. 1: eBeam Initiative Luminaries Survey Results Discussed by Expert Panel (left to right, Aki Fujimura, Naoya Hayashi, Harry Levinson, Glen Scheid) eBeam Initiative (Fujimura): 66% of luminaries predicted that the industry will adopt a large-format mask – approximately 6 x 12 inches – within the…
What is the value of revenue generated from the global EUV lithography materials market? At what rate is the EUV lithography materials demand projected to grow for the next 10 years? What are the historical market sizes and growth rates of…
IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D stacking ST. FLORIAN, Austria,... IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and…
The accelerated evolution of artificial intelligence (AI) is transforming operations across the U.S. Department of War (DOW), Defense Intelligence Agency (DIA) and industry partners. Through enhanced acquisition, adoption and training programs, agencies and organizations are looking to break barriers to innovation.
Nodes, EUV tools, yield, and the push toward angstrom‑class manufacturing.
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