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News

SEMIVISION @_@
tspasemiconductor.substack.com > p > beyond-moores-law-the-rise-of-ai

Beyond Moore’s Law: The Rise of AI System Scaling :SEMICON Taiwan 2026 — From Advanced Packaging and CPO to Memory, Test, and Thermal Innovation

5+ day, 12+ hour ago   (357+ words) AI Semiconductors Enter the System Scaling Era: Advanced Packaging, CPO, HBM, FOPLP, and Testing Emerge as the Next Key Battlegrounds Based on SemiVision’s observations from the technical forums, industry discussions, and exhibition floor at SEMICON Taiwan 2026, the most important industry…...

SEMIVISION @_@
tspasemiconductor.substack.com > p > from-one-gpu-to-an-ai-factory-deep

From One GPU to an AI Factory: Deep Dive into NVIDIA’s Six Hot Chips 2026 Presentations

5+ day, 23+ hour ago   (433+ words) If NVIDIA’s message at Hot Chips 2026 had to be summarized in one sentence, it would be this: the next phase of competition is no longer about who has the fastest GPU. It is about who can combine compute, memory, networking,…...

SEMIVISION @_@
tspasemiconductor.substack.com > p > when-ai-chips-depend-on-a-bottle

When AI Chips Depend on a Bottle of Gas: How WF₆ Is Emerging as a New Bottleneck

1+ week, 15+ hour ago   (175+ words) semivision When AI Chips Depend on a Bottle of Gas: How WF₆ Is Emerging as a New Bottleneck Oroginal Article By SemiVision Research [Reading time: 10 mins] The semiconductor supply constraints created by the AI boom are moving progressively upstream. Over the…...

SEMIVISION @_@
tspasemiconductor.substack.com > p > hot-chips-2026-hbm-base-die-evolves

Hot Chips 2026: HBM Base Die Evolves from a Memory Interface into a Computing Engine — Samsung Unveils a Three-Phase Roadmap Toward Custom HBM, aHBM, and zHBM

1+ week, 22+ hour ago   (326+ words) The AI era, however, is beginning to rewrite this division of responsibilities. The central idea Samsung introduced at Hot Chips 2026 is to apply advanced logic processes to the HBM Base Die, transforming the B-die from what has historically been a…...

SEMIVISION @_@
tspasemiconductor.substack.com > p > canada-plugs-into-taiwans-chip-machine

Canada plugs into Taiwan’s chip machine - From Design to Delivery

1+ week, 6+ day ago   (1406+ words) The next phase of the semiconductor race will be less about copying fabs than about connecting talent, tools and specialised technologies Thank you, TechSoda Research for the invitation. It was a very well-organized and insightful event! For most countries, industrial…...

Google News
tspasemiconductor.substack.com > p > the-abf-squeeze-why-cutting-chinas

The ABF Squeeze: Why Cutting China’s Supply Will Not Fix the Shortage

2+ week, 6+ day ago   (57+ words) AI chips are consuming more substrate material just as manufacturing yields are becoming harder to improve Note: This is only a rumor at this stage and has not been officially announced or confirmed. For substrate makers struggling to secure enough…...

SEMIVISION @_@
tspasemiconductor.substack.com > p > hbf-as-nand-adopts-an-hbm-like-architecture

HBF: As NAND Adopts an HBM-Like Architecture, the AI Memory Hierarchy Is Being Redefined

2+ week, 6+ day ago   (211+ words) A new direction is emerging in AI infrastructure in 2026: NAND flash is no longer being treated solely as storage inside SSDs. Instead, it is beginning to evolve toward a near-compute, high-bandwidth, high-capacity memory tier. One of the most representative technologies…...

SEMIVISION @_@
tspasemiconductor.substack.com > p > why-taiwan-and-japan-need-each-other

Why Taiwan and Japan Need Each Other in the AI Age

3+ week, 2+ day ago   (240+ words) For much of the past three decades, discussions about technology in East Asia have followed a familiar script. America designed the most valuable chips. Taiwan manufactured them. South Korea supplied memory. Japan, once the dominant force in semiconductors, appeared to…...

SEMIVISION @_@
tspasemiconductor.substack.com > p > ai-servers-have-a-new-bottleneck

AI Servers Have a New Bottleneck: Money

1+ mon, 8+ min ago   (1436+ words) For the past two years, the hunt for bottlenecks in artificial intelligence has resembled a game of industrial whack-a-mole. First there were too few advanced GPUs. Then HBM memory became scarce. Next came shortages of advanced packaging, substrates, power equipment,…...

SEMIVISION @_@
tspasemiconductor.substack.com > p > tsmc-sony-vs-chinas-rising-cis-ecosystem

TSMC × Sony vs. China’s Rising CIS Ecosystem: The Next Front in Semiconductor Competition

1+ mon, 1+ day ago   (1520+ words) While almost every semiconductor discussion in 2026 has been dominated by AI GPUs, HBM, advanced packaging and data-center infrastructure, another strategically important semiconductor battle is moving rapidly into the foreground: the image sensor. Sony will remain the controlling shareholder and lead…...