Install
NICs & Adapters
PCIe and USB NICs for multi‑gig Ethernet and Wi‑Fi upgrades.
- 5 Tracked terms
- Last 30 days Feed window
What this topic collects on
An article joins this feed when it matches these terms. Each one is also a search of its own.
Related topics
Latest in NICs & Adapters
Samsung and Qualcomm Forge 2.1D Packaging Alliance
5+ hour, 24+ min ago (138+ words) TechPowerUp Samsung and Qualcomm Forge 2.1D Packaging Alliance - Jul 3rd 2026 Samsung Readies SSD 990 Value Gen 4 NVMe SSD (67) - Feb 6th 2026 NVIDIA to Use SK hynix and Samsung HBM4 for "Vera Rubin" Without Micron (7) - Sep 13th 2026 AI Firms Are Reportedly Buying NVIDIA RTX 5090 GPUs in Bulk for…...
"If You Needed a Real Phone, You Could Have Just Asked Us"... Samsung Takes a Direct Jab at Rose Holding an iPhone
15+ hour, 38+ min ago (452+ words) Published 14 Sep.2026 14:08(KST) Updated 14 Sep.2026 14:24(KST) On the 10th, ROSE shared a mirror selfie taken with the iPhone 18 Pro on her SNS and the official Apple account. This post is known to be part of a collaborative content between Apple and…...
SK hynix deepens TSMC ties for 3D DRAM, diverges from Samsung
11+ hour, 9+ min ago (471+ words) Hynix pursues logic-foundry DRAM approach with TSMC links while Samsung stays in-house According to the semiconductor industry on the 14th, SK hynix, at the "2026 Future Forum" held on the 8th at the Icheon Campus in Gyeonggi Province, presented as the main directions…...
Anti-surge chip resistors delivering 0.33W ⋆ Electronics Weekly
15+ hour, 32+ min ago (294+ words) ROHM has developed the “SDR01 Series” of high anti-surge chip resistors, delivering a class-leading rated power of 0.33W in the 0402 (1005 Metric) size. Designed for electronic equipment where mounting densities continue to increase, the series is well suited for automotive, industrial, consumer electronics,…...
[News] Kepler Claims HBM Alternative Without EUV Using GlobalFoundries’ 28nm Fabs, 2027 Production
18+ hour, 53+ min ago (281+ words) As the AI boom strains supply and pushes up costs, startups are exploring new ways to expand memory production. According to TechPowerUp, Kepler Computing claims to have developed an alternative approach to HBM based on a new 3D stacking technique and…...
DIGITIMES Insight: China's GaN challengers are no longer playing catch-up
16+ hour, 4+ min ago (133+ words) digitimes DIGITIMES Insight: China's GaN challengers are no longer playing catch-up Chinese GaN power semiconductor maker Innoscience gained direct access to capital markets after listing in Hong Kong at the end of 2024, giving it fresh funding to expand GaN capacity…...
OpenAI deepens Samsung partnership on next-generation AI chips
21+ hour, 54+ min ago (196+ words) OpenAI is expanding its partnership with Samsung Electronics as the ChatGPT developer pushes further into designing its own artificial intelligence chips and strengthens ties with South Korea’s semiconductor industry. Harrison Kim, general manager of OpenAI Korea, said the companies had…...
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
20+ hour, 46+ min ago (112+ words) digitimes From assembly and test to intelligent manufacturing - Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek - Update: ABF substrate maker Unimicron searched in origin-labeling probe - Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond…...
Document: Samsung and SK Hynix rejected KEPCO's proposal to prepay ~$18.7B of chip cluster power bills, citing uncertainty over long-term chip demand
17+ hour, 25+ min ago (12+ words) Top news and commentary for technology's leaders, from all around the web....
ZTE OEX and Matrix Supernode Named Among China Computing Power Conference Breakthroughs
18+ hour, 50+ min ago (13+ words) Pandaily...